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Semiconductor Insights Looks Inside Microsoft's Xbox 360 Elite
>> From eetimes.com:
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Semiconductor Insights got hold of the just-released Microsoft Xbox 360 Elite and kept the cameras rolling as they popped the lid and dove inside. The teardown is a follow-on to the company's teardown of the Playstation 3 (view video) and Nintendo Wii (view video) last year and provides insight into what Microsoft is doing to remain competitive in a hotly contested three-way market.
There has been considerable speculation regarding the lithography of the IBM processor. Some sources have claimed that it uses a 65-nm processes lithography, while other claim that it's 90 nm. Semiconductor Insights (SI) performed a cross section of the device, measuring the transistor length, and confirmed that it's the same as that used by the original XBox 360.
"The CPU in the Xbox 360 Elite seems to be assembled in Canada whereas the CPU in the previous Xbox was marked 'Taiwan'," stated Rob Hilkes, a lead technology analyst at SI. "This may indicate that while the previous CPU was built on Chartered's Fab7 in Singapore and assembled in Taiwan, the CPU of the Elite may be built in IBM's Fab B323 in East Fishkill, New York and assembled at IBM's assembly facility in nearby Bromont, Quebec." IBM and Chartered share design data at the 90-nm node. "We seem to have evidence now that Microsoft is indeed using both sources for the XBox CPU." Concern about the original Xbox 360's power consumption may also have been addressed. "Microsoft has redesigned some aspects of the power architecture, resulting in a lower component count."
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Full Story: eetimes.com
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