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Fragile Part of Xbox 360? Thermal Design Expert Investigates
>> From techon.nikkeibp.co.jp:
[QUOTE]
The Xbox 360's power was about 170 W when the DVD equipment was running. The temperature of emitted air was about 45C. A temperature gap with the room temperature (23°C) was 22°C.
"When designing consumer products, it is common to seek a temperature gap of around 10°C between exhaust and room temperatures," the thermal design expert said. "The 22°C is quite a large gap, in the first place."
The cooler fan's maximum wind speed was 1.1 m/s, only 1/2 to 1/3 compared with general desktop PCs. It may be partly because the fan rotation was reduced to lower noise. According to an expert's analysis, "The amount of switched air is slightly in short considering the chassis' size (309 x 258 x 83 mm3)."
To confirm the cooler system's performance, we measured the temperature of heat sinks. Attaching ends of a thermocouple to each heat sink for the microprocessor and graphics LSI, we closed the chassis and then switched on the Xbox 360.
In only five minutes since we started playing the game, the temperature of the heat sink on the graphics LSI rose to 70°C. The thermal gradient was about 10°C/min.
In 15 minutes, the microprocessor heat sink temperature stabilized at 58°C, but the heat sink on the graphics LSI rose to 80°C, 57°C above the room temperature.
Assuming room temperature of 35°C in mid-summer, the gap is estimated to reach more than 90°C. In that case, the temperature of chips in the graphics LSI could exceed 100°C.
We measured the temperature in good cooling environments, removing dust and obstacles from the vent hole, for example. If the cooling performance lowers with the vent hole choked up or the duct moved over, the LSI's temperature could get even higher.
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Full Story: techon.nikkeibp.co.jp
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